Tuesday, April 23, 2013

LightPath Technologies Exhibiting at SPIE Defense, Security + Sensing 2013


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LightPath Technologies Exhibiting at SPIE Defense, Security + Sensing 2013

LightPath Expert to Present on a Practical Approach to LWIR Wafer-based Optics for Thermal Imaging Systems

For Immediate Release
ORLANDO, FL - (PRNewswire – April 23, 2013) - LightPath Technologies, Inc. (NASDAQ: LPTH) (“LightPath”, the “Company” or “we”), a global manufacturer, distributor and integrator of patented optical components and high-level assemblies, today announced it will exhibit at SPIE Defense, Security + Sensing, 2013's most important scientific conferences on optics, imaging, and sensing.  The show takes place April 29-May 3 at the Baltimore Convention Center in Baltimore, MD.
LightPath invites you to visit them at Booth #1451 and be among the first to see LightPath’s new:
  • Thermal imaging assemblies with diamond-like coatings
  • Green lenses: Molded glass aspheric optics optimized to provide high transmission and improved performance for green diode lasers
  • Connectorized collimators: Product line expanded to include 405nm and 633nm wavelengths, new choices for a variety of beam sizes, and a more rugged, improved glass optic
  • Long Wave InfraRed (LWIR) collimating optics: New long wavelength collimating lenses designed to collimate quantum cascade lasers
On May 1st, at 9:40 AM, Ray J. Pini will be presenting a paper entitled "A Practical Approach to LWIR Wafer-based Optics for Thermal Imaging Systems." The paper will compare a typical high volume thermal imaging design manufactured from discrete lens elements to a similar design optimized for manufacture through a wafer-based approach. The presentation will explore both performance and cost trade-offs, as well as review the manufacturability of all designs using LightPath’s molding process.
Jim Gaynor, LightPath CEO, stated, “We are looking forward to seeing OEMs, partners, and prospects at this important industry event. We are particularly looking forward to the opportunity to have Ray Pini discuss the benefits and value of LightPath’s wafer-based molding process for thermal imaging systems.”
DSS is considered the industry's leading meeting for scientists, researchers and engineers from industry, military, government agencies, and academia throughout the world. The event features 55 co-located technical conferences, more than 500 exhibiting companies and agencies and attracts more than 6,500 top scientists, engineers and product developers.
About LightPath Technologies
LightPath provides optics and photonics solutions for the industrial, defense, telecommunications, testing and measurement, and medical industries. LightPath designs, manufactures, and distributes optical and infrared components including molded glass aspheric lenses and assemblies, infrared lenses and thermal imaging assemblies, fused fiber collimators, and gradient index GRADIUM® lenses. LightPath also offers custom optical assemblies, including full engineering design support.  For more information, visit www.lightpath.com.
This news release includes statements that constitute forward-looking statements made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995, including statements regarding our ability to expand our presence in certain markets, future sales growth, continuing reductions in cash usage and implementation of new distribution channels. This information may involve risks and uncertainties that could cause actual results to differ materially from such forward-looking statements. Factors that could cause or contribute to such differences include, but are not limited to, factors detailed by LightPath Technologies, Inc. in its public filings with the Securities and Exchange Commission. Except as required under the federal securities laws and the rules and regulations of the Securities and Exchange Commission, we do not have any intention or obligation to update publicly any forward-looking statements, whether as a result of new information, future events or otherwise.
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